Thermal Conductive Adhesives
ACW thermal conductive adhesives contain no metals and are electrically insulating. They are all-epoxy formulations with thixotropic character and a white appearance. The cured adhesives have high Tg and very low out-gas with thermal conductivities of up to 3+ W/m°K in 75 micron films and up to 1.5+ W/m°K in 500 micron films.
The TCL adhesives are shipped cold (cold pack with NO DRY ICE) and stored at -40 to -20 °C. The have a 2+ day working life time at room temperature and can be cured by heat at temperatures as low as 90 °C. The TCR adhesives are shipped and stored at room temperature and are cured by heat at temperatures of 130-150 °C. The dual cure versions can be cured by light or heat, and heat is required for thick films.
Product | Cure | η (cps)* | Tg (°C) | TC‡ 75 μm (W/m°K) | Data Sheets |
TCL line† | |||||
TCL-104 | heat | 32,000 | 183 | 2.8 | TDS |
TCL-105 | heat | 55,000 | 184 | 3.3 | TDS |
TCL-202 | dual | 32,000 | 183 | 2.8 | TDS |
TCL-203 | dual | 55,000 | 181 | 3.3 | TDS |
TCR line† | |||||
TCR-1002 | dual | 28,000 | 160 | 2.7 | TDS |
TCR-1003 | dual | 55,000 | 166 | 2.6 | TDS |
† TCL adhesives cure thermally at 90 °C; TCR adhesives cure thermally at 130-150 °C.
* Thixotropic paste; the viscosities are reported at 25 °C for a shear rate of 10/s.
‡ Thermal conductivity for 75 micron film. Thermal conductivities vary with film thickness.