ACW offers PFAS-free working stamp resins for both micro- and nano-imprint lithography applications. These materials offer the following advantages: PFAS-free, environmentally friendly and not restricted No anti-stick layer on the working stamp required in the imprint step, thus reducing process steps Excellent chemical resistance, resists etching from aggressive imprint resins and minimizes height gain in Read More…
Category: News
ACW has the Total Package for UV-NIL for AR/VR/MR: Working Stamp and High RI Resins
ACW has been designing, developing and manufacturing imprint lithography resins for two decades, since back when they were known as 2P resins. Our advances in the areas of working stamps and high refractive index (RI) resins have brought us to the point that we can provide the total package for UV nanoimprint lithography (UV-NIL) applications Read More…
ACW will be at JPCA 2024 in Tokyo and NNT 2024 in Lund, Sweden
JPCA 2024, June 12-14. ACW will have a booth at the 2024 JPCA Show at the Tokyo Big Sight. (JPCA-2024) Stop by to learn about ACW’s products. For optoelectronics applications, ACW will feature low outgas epoxy adhesives used in active alignment. For UV-NIL (nanoimprint lithography), ACW will feature high refractive index NIL resins that now Read More…
ACW’s UV-Stabilized High RI UV NIL Resins for AR/VR/MR Applications
Addison Clear Wave announces the release of a new family of high RI UV NIL resins targeted for AR/VR/MR applications. The LuxNIL® U resins exhibit order of magnitude increased UV stability compared to conventional high RI UV NIL resins as evaluated in “sunlight” exposure studies. The attached whitepaper compares the new LuxNIL® U resins with Read More…
UV-NIL for augmented reality / virtual reality / mixed reality (AR/VR/MR) waveguides
In collaborative work, Addison Clear Wave and EV Group demonstrated commercially viable UV-NIL manufacturing processes. SmartNIL® processing of LuxNIL® resins gave the following results. Refractive Index: 1.82 – 1.96 at 633 nm Resolution: 50 nm Height Gain: 0.64 – 0.80 nm average for 25 imprints Download the jointly issued Whitepaper for details of the process Read More…
ACW Releases Photo-cure Stamp Resins for Nanoimprint Lithography (NIL)
Photo Nanoimprint Lithography (P-NIL) promises to be a rapid and low cost methodology for manufacturing optical, electronic and optoelectronic micro-scale and nano-scale devices. One obstacle for the methodology is the high cost of molds or masters that will have a finite lifetime in terms of multiple copies. The work-around for this cost is to use Read More…
ACW High Refractive Index Materials for Nano-Imprint Lithography for AR/VR/MR
High refractive index (RI) materials are employed for production of quality diffractive optical elements (DOE) used in augmented, virtual, and mixed reality (AR/VR/MR) devices and a variety of optical sensors. Higher RI DOEs provide wider fields of view (FOV), and low-cost mass production of DOEs with RIs greater than 1.7 can be accomplished using photo Read More…
Very High Refractive Index Resins for P-NIL Applications
ACW introduces a new line of LuxNIL® very high RI resins for P-NIL VR/AR/MR applications or other thin coatings. These resins are hybrid organic/inorganic, low viscosity formulations containing PGMEA. They are suitable for spin coating, gravure coating, or ink-jetting to give thicknesses of 100 nm to 3 microns after evaporation of the PGMEA. The cured Read More…
Adhesives that block Visible and Near IR light
Do you want a UV-cure adhesive that blocks visible or Near IR light? At first thought, that might seem to be a paradox, but ACW has found a way to do just that. A1867-TX and A1867-TX2 are sister adhesives with different thixotropic indices. These are dual-cure (UV or heat) epoxy adhesives that will cure with Read More…
Adhesives that Survive Solder Reflow
Those working with semiconductors are familiar with solder reflow conditions. A PCB containing solder and flux is heated to ca. 150 °C (pre-heat), held there for 1-2 minutes (soak), heated to ca. 260 °C, then cooled. As devices are miniaturized, physical clamps holding and aligning components are increasingly replaced with adhesives. But solder reflow conditions Read More…