Dual Cure Adhesives
ACW’s Dual Cure Epoxy Adhesives can be cured with UV light or heat. These are single component resins that offer long working lives at room temperature. These products are especially good for active alignment applications. Use UV to set the alignment and heat to cure the adhesive in shaded areas. Thixotropic versions are available. Thermal conductive versions are boron nitride filled. For more details about Dual Cure Epoxy adhesives, see the Dual Cure page in the Blog section. For a quick reference to popular Dual Cure Epoxies for active alignment applications, see the Dual Cure Table.
dispense mate fix cure
Applications: glass to glass bonding, glass to ceramic bonding, glass to plastic bonding, semiconductor or optoelectronic packaging, component packaging, active alignment applications, and camera module assembly.
| Product | η (cps, 25 °C) | Tg (°C) | Applications | Data Sheets |
| Dual Cure (85 °C) | ||||
| A1853 | 4,500 | 155 | A, B, C, D, F, No Sb | TDS |
| A1851-TX | thixotropic, 11,000* | 164 | A, B, C, F, No Sb | TDS |
| A1853-TX | thixotropic, 70,000* | 165 | A, B, C, E, F, No Sb | TDS |
| A1855-TX | thixotropic, 65,000* | 175-180 | A, B, C, E, F, No Sb | TDS |
| Dual Cure (90-100 °C) | ||||
| A539-DM | 1,900 – 2,200 | 145 | A, B, C | TDS |
| A1721-TX | thixotropic, 12,000* | 165 | A, B, C, No Sb | TDS |
| A1723-TX | thixotropic, 9,000 | 165 | A, B, C, No Sb | TDS |
| TCL-202 | thixotropic, 32,000* | 183 | A, B, E, F, G, No Sb | TDS |
| TCL-203 | thixotropic, 55,000* | 181 | A, B, E, F, G, No Sb | TDS |
| CM-500 | thixotropic, 65,000* | 145 | A, B, No Sb | TDS |
| Dual Cure (110-130 °C) | ||||
| TA 101-S | 30,000 – 34,000 | 50 | A, B, D, G, I, No Sb | TDS |
| Dual Cure (130-150 °C) | ||||
| A535-AT | 1,200 – 1,500 | 160 | A, B, C, D, E | TDS |
| A1708-A | 4,200 – 4,500 | 168 | A, B, C, D, E | TDS |
| A1708-TX | thixotropic, 13,000* | 178 | A, B, C, D, E | TDS |
| A1708-TX2 | thixotropic, 50,000* | 170 | A, B, C, D, E | TDS |
| A1710-TX2 | thixotropic, 50,000* | 170 | A, B, C, noSb | TDS |
| TCR-1002 | thixotropic, 28,000* | 160 | A, B, E, G | TDS |
| TCR-1003 | thixotropic, 55,000* | 166 | A, B, E, G | TDS |
* Viscosity for thixotropic paste when measured at shear rate of 10/s.
APPLICATIONS
A: Bonding
B: Semiconductor, CMOS bonding, chip & component packaging
C: Active alignment
D: Die-attach
E: Low outgas; meets MIL-STD 883/5011
F: Compatible with PC lenses and optical components in camera modules
G: Thermal conductive
H: High depth of UV cure
I: Compliant, rubbery