Low Outgas Adhesives
Several ACW products qualify as low outgas adhesives against the MIL-STD 883/5011, and Telcordia GR-1221 standards. If you are looking for a low outgas adhesive for your application, see the list of products on the Low Outgas page of the Products Page by clicking HERE.
Low Temperature Dual Cure Epoxies (UV or heat)
ACW offers lines of Dual Cure epoxies that can be cured with either UV or heat to obtain high Tg epoxies with excellent reliability performance. All of the dual cure epoxies have room termperature pot lives (or working lives) of three days or more and shelf lives of several months when stored under appropriate conditions. The fully cured sealants have high Tg and excellent adhesion to many substrates (glass, ceramic, metal, and plastic) expected for epoxies. They are excellent candidates for camera module fabrication, semi-conductor packaging, optoelectronics assembly, and die attach applications. They allow an instant "UV-fix" for aligned parts at edges that can see light, and the fixed component can then be heated to give complete resin curing, including in areas that are shaded from light. The low temperature cure versions are compatible with polycarbonate lenses. Details about Dual Cure Epoxy adhesives are given in the Dual Cure page of the Blog.
The newest Dual Cure epoxies have increased photo sensitivity allowing photo-curing with as little as 2-3 J of 365 nm light (LED) or UVA from a mercury lamp. The thermal cure temperatures have consistently been reduced since the release of this product line and can be as low as 70 °C. For more details about the Dual Cure adhesives, see the Dual Cure Adhesives page of the Products section.
ACW's New UV-Snap Cure Epoxies
Are you assembling temperature-sensitive components with shaded regions? If so, your choices of adhesives are limited. For your demanding applications, ACW offers UV-Snap Cure epoxies, adhesives developed for optoelectronics, electronics and semi-conductor packaging where the parts are opaque or have shaded areas and the components are temperature sensitive.
UV-Snaps are one-component epoxies that are room temperature stable as received. Their processing cycle is shown below. After dispensing, the UV-Snap is activated by a short burst of UV light. The activated adhesive cures evenly (i.e. no skin forms at the surface) and has an open period of up to a minute during which the parts are mated and, if necessary, held in active alignment. A second burst of UV light fixes the aligned parts; this step is optional if precise alignment is not necessary. Finally, a thermal cure step completes the curing in shaded regions. The thermal cure temperature can be as low as 60-80 °C for 30-60 minutes for thermally sensitive components; for less sensitive components, the thermal cure step can be as short as 5 minutes at 110-120 °C.
dispense activate align fix cure
UV-Snap Cure adhesives are available with either standard flow properties or as thixotropic materials. They offer the typical advantages of epoxy adhesives including high adhesion, low shrinkage, and excellent environmental behavior. For opaque or UV-blocking materials, they provide much shorter cure times than two-part epoxies and lower cure temperatures than thermal cure acrylates. The cured materials have high Tg and a wide range of operating temperatures.