UV-Snap Cure Epoxies are designed to bond opaque or shaded temperature-sensitive substrates. The one component adhesives are stable at room temperature. The adhesives are dispensed and then activated by a short UV irradiation step, which does not produce a surface skin on the epoxy. The parts are mated and aligned, and an optional second UV irradiation fixes the component if precise alignment is necessary. Finally, a thermal step that can be as low as 70-80 °C for 30-60 minutes completes the curing. These epoxies are available in normal viscosity and thixotropic versions. For more discussion, see UV-Snap Cure adhesives.
dispense activate mate fix cure
Applications: glass to glass bonding, glass to ceramic bonding, glass to plastic bonding, semiconductor or optoelectronic packaging, component packaging, active alignment applications, and camera module assembly.
|Product||η (cps, 25 °C)||Tg (°C)||Applications||Data Sheets|
|A535-AN-S||2,700 - 3,200||155||A, B, C, D, E||TDS, SDS|
|A535-TXS||thixotropic, 9,000*||160||A, B, C, D, E||TDS|
|A1452-S||3,200 - 3,800||150||A, B, C, D, E||TDS, SDS|
* Viscosity for thixotropic paste measured at a shear rate of 10/s.
B: Semiconductor, chip & component packaging
C: Active alignment
E: Compatible with PC lenses and optical components in camera modules