UV - Snap Cure Adhesives


UV-Snap Cure Epoxies are designed to bond opaque or shaded temperature-sensitive substrates.  The one component adhesives are stable at room temperature.  The adhesives are dispensed and then activated by a short UV irradiation step, which does not produce a surface skin on the epoxy.  The parts are mated and aligned, and an optional second UV irradiation fixes the component if precise alignment is necessary.  Finally, a thermal step that can be as low as 70-80 °C for 30-60 minutes completes the curing.  These epoxies are available in normal viscosity and thixotropic versions.  For more discussion, see UV-Snap Cure adhesives.

dispense   activate      mate         fix           cure

Applications:  glass to glass bonding, glass to ceramic bonding, glass to plastic bonding, semiconductor or optoelectronic packaging, component packaging, active alignment applications, and camera module assembly. 

Product η (cps, 25 °C) Tg (°C) Applications   Data Sheets
A535-AN-S 2,700 - 3,200   155 A, B, C, D, E  TDS, SDS
A535-TXS thixotropic, 9,000*   160 A, B, C, D, E  TDS
A1452-S 3,200 - 3,800   150 A, B, C, D, E  TDS, SDS

* Viscosity for thixotropic paste measured at a shear rate of 10/s.

A: Bonding
B: Semiconductor, chip & component packaging
C: Active alignment
D: Die-attach
E: Compatible with PC lenses and optical components in camera modules