Dual Cure Adhesives

ACW's Dual Cure Epoxy Adhesives can be cured with UV light or heat.  These are single component resins that offer long working lives at room temperature.  These products are especially good for active alignment applications.  Use UV to set the alignment and heat to cure the adhesive in shaded areas.  Thixotropic versions are available.  Thermal conductive versions are boron nitride filled.  For more details about Dual Cure Epoxy adhesives, see the Dual Cure page in the Blog section.

dispense      mate          fix             cure

Applications:  glass to glass bonding, glass to ceramic bonding, glass to plastic bonding, semiconductor or optoelectronic packaging, component packaging, active alignment applications, and camera module assembly. 

Product η (cps, 25 °C) Tg (°C) Applications   Data Sheets
Dual Cure (70-85 °C)
     
A1857-TX thixotropic, 22,000* 165 A, B, C, D, F TDS
A1858-TB thixotropic, 22,000* 165 A, B, C, D, F TDS
A1856-TB thixotropic, 68,000* 165 A, B, C, D, F TDS
A1821-TX thixotropic, 22,000* 160 A, B, C, D, F TDS
A1819 2,300 - 2,700 155 A, B, C, D, F TDS
Dual Cure (80-90 °C)        
AC A1805 2,300 - 2,700 130 A, B, C, D, F TDS, SDS
AC A1805-TX thixotropic, 12,000* 130 A, B, C, D, F TDS, SDS
Dual Cure (85-100 °C)        
AC A539-DM 1,900 - 2,200 145 A, B, C,  TDS, SDS
AC A1719-TX thixotropic, 9,000* 164 A, B, C, D, F TDS, SDS
Dual Cure (125 °C)        
AC A535-AT 1,000 – 1,300 160  A, B, C, D, E TDS, SDS
AC A1708-A 4,200 - 4,500 168  A, B, C, D, E
TDS, SDS
AC A1705-A 9,200 – 9,700 170  A, B, C, D, E TDS, SDS
AC A1705-TX thixotropic, 22,000* 184  A, B, C, D, E TDS, SDS
AC A1708-TX thixotropic, 13,000* 178  A, B, C, D, E TDS, SDS
Thermal Conductive Dual Cure        
TCL-202 thixotropic, 32,000* 183 A, B, E, F, G TDS
TCL-203 thixotropic, 55,000* 181 A, B, E, F, G TDS
TCR-1002 thixotropic, 28,000* 160  A, B, E, G TDS
TCR-1003 thixotropic, 55,000* 166  A, B, E, G TDS

* Viscosity for thixotropic paste when measured at shear rate of 10/s.
APPLICATIONS
A: Bonding
B: Semiconductor, chip & component packaging
C: Active alignment
D: Die-attach
E: Low outgas; meets MIL-STD 883/5011
F: Compatible with PC lenses and optical components in camera modules
G: Thermal conductive