Camera Module Packaging



Camera module design and fabrication has rapidly evolved as components are reduced in size and resolutions are improved.  The high precision necessary for camera modules requires active alignment methods where an adhesive is dispensed in precise positions, components are mated, the assembly is oriented with active alignment, and the aligned assembly is fixed by UV curing.  Because the assembed component contains shaded areas, dual cure adhesives have been designed that can be cured by both UV light and heat.

camera module bonding

Most dual cure adhesives contain two distinct resins and initiators for the UV and thermal processes.  Addison Clear Wave's approach to highly demanding dual cure applications such as camera module assembly has been to develop single component epoxy resins that contain both UV and thermal initiators.  This unique design avoids problems arising when a portion of the adhesive in shaded areas remains uncured after the thermal step.  Moreover, it offers the advantage of working with epoxy-only formulations that can be cured to high Tg and high reliability resins with outstanding adhesion and environmental properties.  

ACW's dual cure epoxies for cameral module packaging have been evolving rapidly in the past two years, and we now offer the clear and black epoxy versions listed below.  These adhesives cure fast either with UV (mercury, metal halide, LED 365 nm) or heat (80 °C for 60-120 minutes).

Epoxy viscosity Tg   color data sheet application
A1821-TX thixo 10,000* 160 translucent   TDS lens barrel
A1857-TX thixo 22,000* 165 translucent   TDS lens barrel
A1858-TB thixo 22,000* 165 black   TDS lens barrel
A1856-TB thixo 68,000* 165 grey   TBS image sensor

*thixotropic resins, the viscosity at a shear rate of 10/s is listed

A general discussion of ACW dual cure epoxy adhesives can be found on the Dual Cure blog page, and a detailed listing of ACW's dual cure epoxies for various applications is presented on the Dual Cure Adhesives product page.